Question 1

Which boards and defects can it inspect?

Accepted Answer

PCB-A up to 300 × 225 mm. Covered items are THT missing, wrong and reversed parts; solder faults (bridge, no solder, insufficient, excess, pinhole, cold joint, spike); missing or damaged SMD chip resistors and MLCCs; and solder balls or residue. Coverage for your boards is confirmed by sample validation after an initial consultation.

Question 2

Does it inspect both sides?

Accepted Answer

Yes. REX 1.5 captures the front, then flips the board itself and captures the back (Auto-Flip). On REX 1 the operator turns it over. Loading and unloading the jig is manual on both models.

Question 3

What preparation is needed before deployment?

Accepted Answer

Tell us your board types and the items you want inspected, and we confirm coverage with sample validation. In operation, some items need a reference registered — a good-board reference image for THT comparison, for example. There is no per-board rule teaching.

Question 4

Can it run where internet access is restricted?

Accepted Answer

An on-site GPU inference setup can be considered. Tell us your requirements — an air-gapped network, for example — and we review the operating structure with you.

Question 5

How does it fit with our existing inspection?

Accepted Answer

REX performs visual inspection from a 2D top-down image at the outgoing (OQC) stage. It does not replace electrical test, X-ray or 3D metrology, and dimensional items such as 3D profile and height are out of scope.

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